Introducing the Groundbreaking ZM-R7220A-BGA Rework Station
Immerse yourself in cutting-edge innovation with our high-precision BGA mounting head, equipped with a CCD optical align lens and an intuitive touch screen control system. The Optical Alignment System, brought to you by Guangzhou Chuang Li You Machinery Co., Ltd., is the pinnacle of industry excellence.
Achieve unparalleled precision with our advanced laser positioning and joystick control, guaranteeing flawless results every single time.
Comprehensive Product Application Overview
- Our sophisticated system excels at de-soldering and soldering all BGA components. It proficiently removes and repairs various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes with expertise.
- 2. Significantly reduce production costs by reworking faulty soldering IC chips during PCB assembly, delivering unmatched efficiency.
- Our advanced Optical Alignment System streamlines BGA rework, significantly reducing eye strain while boosting productivity.
- Engineered for precision, this system excels in reworking BGA, LED, IC, and other micro chipsets. Perfect for high-precision motherboard rework, it delivers reliable and repeatable results.
- Ideal for BGA reballing and chipset repair, this machine is extensively used in laptops, PS3, PS4, XBOX360, mobile phones, and more.
- Efficiently manage rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond with exceptional ease and precision.
Key Features of the ZM-R7220A
- Featuring a large infrared carbon fiber pre-heating system, it heats rapidly and uniformly while eliminating light pollution, ensuring optimal working conditions.
- Temperature parameters are safeguarded by authority limits, preventing any erroneous settings and ensuring safety and reliability.
- Supports ten segments of temperature control processes, ensuring compatibility with a wide array of BGA rework requirements.
- Store unlimited temperature profiles and access the required profiles instantly with a single key press, enhancing usability.
- Three K-type sensors provide high-precision temperature testing and automatic curve analysis reports via PC for detailed monitoring.
- Automated de-soldering and soldering processes minimize manual intervention, enhancing both efficiency and consistency.
- Adjustable hot air flow allows customization of the rework process for various chips, ensuring optimal outcomes.
- Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation.
- Convenient bottom hot air lifting control from the front panel enables on-the-fly adjustments, enhancing ease of use.
- Laser positioning accelerates and enhances the precision of component placement, making the process quicker and more accurate.
In-Depth Features Overview
Independent Control Heaters
Top and bottom heaters use hot air, while the third IR heater employs infrared heating. These heaters can heat the PCB simultaneously from both sides with temperature accuracy within ±3ºC. Multi-segment settings are available, and the adjustable IR preheating area ensures even heating across the PCB.
Simultaneous heating of the PCB board and BGA chips, with the third IR heater preheating from below to prevent deformation during repairs. Top and bottom heaters operate independently for precise control.
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Choose from high-accuracy K-type close-loop thermocouple and PID parameters automatic adjustment system, ensuring precise temperature control.
Display seven temperature curves, save millions of data groups via U storage device, and utilize instant curve analysis for real-time BGA temperature assessment. Sensors ensure precise and reliable temperature readings.
Unmatched Precision with Our Advanced Optical Alignment System
Boasting an advanced adjustable CCD color optical system, our kit integrates beam split, zoom, and micro-adjustment functionalities. It features automatic chromatism resolution and brightness adjustment, magnifying up to a stunning 230X with remarkable mounting accuracy within ±0.02mm.
Ultimate Multi-Function Operational System
Step into a new era of precision with our high-definition human-machine interface, expertly designed for flawless 'setup' and 'operate' modes. This intuitive interface dramatically reduces errors. Our innovative 2-in-1 top heater and mounting head design automatically detects BGA chips and mounting heights, delivering outstanding soldering and de-soldering performance. Tailor and store up to 6 segments of rising and activity temperatures, with the capability to save multiple temperature profiles. The machine seamlessly adapts to all BGA nozzles, offering 360° rotation for effortless installation and replacement. Customization options are available to meet your specific requirements.
Experience rapid, precise positioning with incredible ease using our V-groove PCB support, ideal for all PCB types. The flexible, removable universal fixture provides protective effects without damaging the PCB board, making it perfect for various BGA repair sizes.
Unmatched Safety Features
Safety is paramount with our CE-certified system, which triggers an alarm after soldering and de-soldering. It automatically powers off during temperature anomalies, offering double-layer protection. Secure temperature parameters with a password to prevent unauthorized alterations.
Prevent unauthorized changes
with our cutting-edge safety features,
ensuring comprehensive protection for
PCB board components and the machine itself
under any abnormal conditions.
Detailed Specifications and Technical Parameters
Power Supply: AC 220V±10%
Frequency Range: 50/60 Hz
Maximum Total Power: 5650W
Heater Power: Top heater 1450W, Bottom heater 1200W, IR heater 2700W
Control System: Intelligent Programmable Controller, supports computer connectivity
Temperature Control: K-type thermocouple (Closed Loop), with accuracy within ±3ºC
Positioning System: V-groove, PCB support
PCB Size Range: Max 415×370 mm, Min 6×6 mm
BGA Chip Size Range: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Net Weight: 76 kg
Color: Sleek White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
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|
|
| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
|
| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
|
| Tool box |
1 |
|
|
|
| PCB Fixture |
6 |
|
|
|
| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
|
| Vacuum sucker(max ) |
4 |
|
|
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| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
|
| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
|
| K-type temperature line |
1 |
|
|
|
| Upper heating wire(1200W) |
1 |
|
|
|
| Heating plate(Black 1450W) |
1 |
|
|
|
| Total |
44 |
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