• Optical Alignment Soldering Workstation Bundle
  • Optical Alignment Soldering Workstation Bundle
  • Optical Alignment Soldering Workstation Bundle
  • Optical Alignment Soldering Workstation Bundle
  • Optical Alignment Soldering Workstation Bundle
  • Optical Alignment Soldering Workstation Bundle

Optical Alignment Soldering Workstation Bundle

After-sales Service: Online 24 Hours
Warranty: 1 Year
Type: Induction Heating Machine
Customization:
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Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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Optical Alignment Soldering Workstation Bundle pictures & photos
Optical Alignment Soldering Workstation Bundle
US $5,000-5,500 / Piece
Min. Order: 1 Piece
Gold Member Since 2018

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Basic Info.

Model NO.
ZM-R7220A
Certification
CE
Structure
Horizontal Type
Transport Package
Wooden Box
Specification
L81*W82*H115cm
Trademark
cly
Origin
China
HS Code
8515809090

Packaging & Delivery

Package Size
81.00cm * 82.00cm * 115.00cm
Package Gross Weight
125.000kg

Product Description

Introducing the Revolutionary ZM-R7220A-BGA Rework Station
Optical Alignment Soldering Workstation Bundle
Experience the epitome of technological advancement with our ZM-R7220A-BGA Rework Station, featuring a high-precision BGA mounting head, a state-of-the-art CCD optical align lens, and an intuitive touch screen control system. Manufactured by the esteemed Guangzhou Chuang Li You Machinery Co., Ltd., this Optical Alignment System sets the industry gold standard, delivering unmatched precision and ease of use.

Attain unparalleled precision with our cutting-edge laser positioning and joystick control, ensuring flawless results every time you engage the ZM-R7220A-BGA Rework Station.

Comprehensive Product Application Overview
  1. Our advanced system excels at de-soldering and soldering all BGA components. It efficiently removes and repairs various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes. This versatility makes it an indispensable tool for any repair needs.
  2. 2. Significantly reduce production costs by reworking faulty soldering IC chips during PCB assembly with exceptional efficiency, minimizing waste and boosting productivity.
  3. Our sophisticated Optical Alignment System streamlines BGA rework, significantly reducing eye strain and enhancing efficiency. Technicians can achieve perfect results effortlessly.
  4. Designed with precision in mind, this system is exceptional for reworking BGA, LED, IC, and other micro chipsets. It is particularly ideal for high-precision motherboard rework, offering reliable and repeatable outcomes, ensuring meticulous care for your most delicate components.
  5. Ideal for BGA reballing and chipset repair, this machine is extensively used in laptops, PS3, PS4, XBOX360, mobile phones, and more. It is a versatile tool for a wide array of electronic repairs.
  6. Effortlessly handle rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and more with unmatched precision, ensuring all your repair needs are met to the highest standards.


Key Features of the ZM-R7220A
  • Equipped with a large infrared carbon fiber pre-heating system, it heats rapidly and uniformly while eliminating light pollution. This ensures optimal working conditions and maximizes efficiency.
  • Temperature parameters are safeguarded by authority limits, preventing erroneous settings and ensuring safety and reliability. This provides peace of mind during operations.
  • Supports up to ten segments of temperature control processes, ensuring compatibility with a diverse range of BGA rework requirements, making it highly adaptable for various tasks.
  • Store unlimited temperature profiles and access them instantly with a single key press. This feature enhances usability and saves time during setups.
  • Three K-type sensors provide high-precision temperature testing, offering automatic curve analysis reports via PC. This ensures detailed monitoring and accurate adjustments.
  • Automated de-soldering and soldering processes minimize the need for manual intervention, boosting efficiency and consistency, ensuring every job meets high standards.
  • Adjustable hot air flow enables customization of the rework process for various chips, ensuring optimal outcomes tailored to your specific needs.
  • Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation, making the system user-friendly and highly efficient.
  • Convenient bottom hot air lifting control from the front panel allows on-the-fly adjustments, enhancing usability and enabling real-time changes during operations.
  • Laser positioning accelerates and enhances the precision of component placement, making the process faster and more accurate, reducing errors and improving overall quality.
In-Depth Features Overview

Independent Control Heaters
Top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. These heaters can heat the PCB simultaneously from both sides with temperature accuracy within ±3ºC. Multi-segment settings and an adjustable IR preheating area ensure even heating across the PCB, preventing warping and guaranteeing high-quality repairs.
Experience precision with simultaneous heating for both PCB boards and BGA chips, supported by a third IR heater that preheats from below to prevent deformation during repairs. Our top and bottom heaters operate independently, giving you precise control and maximizing repair effectiveness.
.
Opt for unparalleled accuracy with our high-precision K-type close-loop thermocouple and state-of-the-art PID parameters automatic adjustment system. This ensures precise temperature control and delivers consistently perfect results.
Visualize seven temperature curves and save millions of data groups via a U storage device. Utilize instant curve analysis for real-time BGA temperature assessment. Our sensors offer precise and reliable temperature readings, providing the data you need for high-quality work.
Achieve unmatched precision with our Advanced Optical Alignment System, ensuring perfect alignment and superior results for all your rework needs.
Enhance your soldering precision with our advanced adjustable CCD color optical system. This cutting-edge system features beam split, zoom, and meticulous micro-adjustment capabilities. With automatic chromatism resolution and adaptive brightness adjustment, it magnifies up to an astonishing 230X, achieving a mounting accuracy within ±0.02mm.

Versatile Multi-Function Operation System
Experience flawless precision with our high-definition human-machine interface, designed meticulously for 'set up' and 'operate' modes. This reduces errors significantly. Our innovative top heater and mounting head 2-in-1 design automatically detects BGA chips and mounting heights, ensuring superior soldering and de-soldering. Tailor and save up to 6 segments of rising and activity temperatures, and store multiple temperature profiles. The machine adapts to all BGA nozzles with effortless 360° rotation, facilitating easy installation and replacement. Customization options ensure it meets your unique requirements.
Achieve rapid, precise positioning with our V-groove PCB support, ideal for all PCB types. The flexible, removable universal fixture offers exceptional protective effects without causing damage to the PCB board, comfortably accommodating various BGA repair sizes.
Unparalleled Safety Functions
Certified with CE for ultimate safety, our sophisticated system triggers an alarm post-soldering and de-soldering, and automatically powers off during temperature anomalies. This double-layer protection ensures secure soldering. Password-protect your temperature parameters to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features
ensuring robust protection for
your PCB board components and the machine itself
in any abnormal situation.

Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer interface
Temperature Control: K-type thermocouple (Closed Loop), independent control with precision within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
ZM-R7220A BGA Rework Station Standard Accessories List
  Accessories Quantity      
Standard ZM-R7220A Seamark ZM BGA Rework Station 1      
Wooden case 1      
Manual 1      
Flux Brush 1      
Tool box 1      
PCB Fixture 6      
Handle Screw 6      
M5*28 Supporting Screw 6      
Vacuum sucker(max ) 4      
Vacuum sucker(Mid ) 4      
Vacuum sucker(Min) 4      
Top Nozzle 10*10mm 1      
Top Nozzle 20*20mm 1      
Top Nozzle 31*31mm 1      
Top Nozzle 41*41mm 1      
Bottom Nozzle 35*35 1      
Temperature sensor 1      
K-type temperature line 1      
Upper heating wire(1200W) 1      
Heating plate(Black 1450W) 1      
Total 44      

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From payment to delivery, we protect your trading.
Optical Alignment Soldering Workstation Bundle pictures & photos
Optical Alignment Soldering Workstation Bundle
US $5,000-5,500 / Piece
Min. Order: 1 Piece
Gold Member Since 2018

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory & Trading Company
Year of Establishment
2016-09-27
Plant Area
1000 square meters