Introducing the Revolutionary ZM-R7220A-BGA Rework Station - Elevate Your Rework Precision
Experience cutting-edge technology with our high-precision BGA mounting head, featuring a CCD optical align lens and an intuitive touch screen control system. The Optical Alignment System by Guangzhou Chuang Li You Machinery Co., Ltd. sets the gold standard in the industry, ensuring unparalleled accuracy and ease of use.
Achieve unmatched precision with state-of-the-art laser positioning and joystick control, guaranteeing flawless results every time, making intricate work feel effortless.
Comprehensive Product Application Overview - Versatility at its Best
- Our advanced system excels in de-soldering and soldering all BGA components. It can expertly remove and repair various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes with superior efficiency.
- 2. Dramatically cut production costs by reworking faulty soldering IC chips during PCB assembly with unparalleled efficiency, ensuring your production line runs smoothly and cost-effectively.
- Our sophisticated Optical Alignment System simplifies BGA rework, significantly reducing eye strain and boosting efficiency, allowing for long hours of precise work without fatigue.
- Designed for precision, this system excels at reworking BGA, LED, IC, and other micro chipsets. It is particularly ideal for high-precision motherboard rework, offering reliable and repeatable outcomes that meet the highest industry standards.
- Perfect for BGA reballing and chipset repair, this machine is extensively used in laptops, PS3, PS4, XBOX360, mobile phones, and more, providing versatility across various devices.
- Efficiently handle rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond with ease and precision, making your rework process versatile and comprehensive.
Key Features of the ZM-R7220A - Innovation at Your Fingertips
- Equipped with a large infrared carbon fiber pre-heating system, it heats swiftly and uniformly while eliminating light pollution, ensuring optimal working conditions that enhance productivity and safety.
- Temperature parameters are protected by authority limits, preventing any erroneous settings and ensuring safety and reliability, so you can work with confidence.
- Supports ten segments of temperature control processes, ensuring compatibility with a wide range of BGA rework requirements, making it adaptable to various needs.
- Store unlimited temperature profiles and access the necessary profiles instantly with a single key press, enhancing usability and simplifying your workflow.
- Three K-type sensors offer high-precision temperature testing and provide automatic curve analysis reports via PC for detailed monitoring, ensuring accurate results every time.
- Automated de-soldering and soldering processes reduce the need for manual intervention, enhancing efficiency and consistency, so you achieve perfect results with minimal effort.
- Adjustable hot air flow allows customization of the rework process for various chips, ensuring optimal outcomes tailored to your specific requirements.
- Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation, making your setup quick and straightforward.
- Convenient bottom hot air lifting control from the front panel enables on-the-fly adjustments, enhancing ease of use and allowing for real-time modifications during rework.
- Laser positioning accelerates and enhances the precision of component placement, making the process faster and more accurate, reducing rework time significantly.
In-Depth Features Overview - Optimize Every Detail
Independent Control Heaters - Precision Heating at its Best
Top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. These heaters can heat the PCB simultaneously from both sides with temperature accuracy within ±3ºC. Multi-segment settings are available, and the adjustable IR preheating area ensures even heating across the PCB for perfect rework results.
Simultaneous heating of the PCB board and BGA chips, with the third IR heater preheating from below to prevent deformation during repairs. Top and bottom heaters operate independently for precise control, ensuring optimal outcomes.
.
Choose from high-accuracy K-type close-loop thermocouple and PID parameters automatic adjustment system, ensuring precise temperature control and consistency across all operations.
Display seven temperature curves, save millions of data groups via U storage device, and utilize instant curve analysis for real-time BGA temperature assessment. Sensors ensure precise and reliable temperature readings, allowing for meticulous monitoring.
Unmatched Precision with Our Advanced Optical Alignment System - See the Difference
Our Advanced CPU IC Removal Tool Set boasts an adjustable CCD color optical system with sophisticated beam split, zoom, and micro-adjustment capabilities. This system features automatic chromatism resolution and brightness adjustment, magnifying up to an impressive 230X with mounting accuracy within an ultra-precise ±0.02mm.
Unleash the power of versatility with our Multi-Function Operation System.
Step into a new realm of precision with our high-definition human-machine interface, meticulously designed for flawless 'set up' and 'operate' modes, drastically reducing operational errors. Our groundbreaking 2-in-1 top heater and mounting head design automatically detects BGA chips and their mounting heights, ensuring exceptional soldering and de-soldering performance. Customize and save up to 6 segments of rising and activity temperatures, with the convenience of multiple temperature profile storage. Effortlessly adapt to all BGA nozzles, featuring 360° rotation for seamless installation and replacement. Customization options are readily available to cater to your unique needs.
Experience rapid and precise positioning with unparalleled ease, thanks to our V-groove PCB support, perfectly suited for all types of PCBs. The flexible and removable universal fixture offers protective effects without damaging the PCB board, comfortably accommodating various BGA repair sizes.
Unmatched Safety Functions
Earn peace of mind with our CE-certified safety system, which triggers an alarm post-soldering and de-soldering. It automatically powers off when temperature anomalies occur, providing double-layer protection. Secure temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our state-of-the-art safety features,
ensuring unparalleled protection for
PCB board components and the machine itself,
even in abnormal situations.
Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, with computer connectivity support
Temperature Control: K-type thermocouple (Closed Loop), independent control with accuracy within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
|
|
|
| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
|
| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
|
| Tool box |
1 |
|
|
|
| PCB Fixture |
6 |
|
|
|
| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
|
| Vacuum sucker(max ) |
4 |
|
|
|
| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
|
| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
|
| K-type temperature line |
1 |
|
|
|
| Upper heating wire(1200W) |
1 |
|
|
|
| Heating plate(Black 1450W) |
1 |
|
|
|
| Total |
44 |
|
|
|
Audited Supplier 
){kind=link}
){kind=link}