Introducing the Revolutionary ZM-R7220A-BGA Rework Station
Experience cutting-edge technology with our high-precision BGA mounting head, featuring a CCD optical align lens and an intuitive touch screen control system. The Optical Alignment System by Guangzhou Chuang Li You Machinery Co., Ltd. sets the gold standard in the industry, offering unparalleled precision and ease of use. Elevate your rework capabilities with the ultimate in accuracy and user-friendly operation.
Achieve unmatched precision with our state-of-the-art laser positioning and joystick control, ensuring flawless results every time you use the ZM-R7220A-BGA Rework Station. Our advanced technology guarantees that each component is placed with exacting accuracy, making your rework projects successful and efficient.
Comprehensive Product Application Overview
- Our advanced system is adept at de-soldering and soldering all BGA components. It can expertly remove and repair various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes, making it a versatile choice for any repair needs. Master any challenge with our robust and adaptable rework station.
- 2. Dramatically cut production costs by reworking faulty soldering IC chips during PCB assembly with unparalleled efficiency, reducing waste and enhancing productivity. Save both time and resources, ensuring your operations are as cost-effective as they are precise.
- Our sophisticated Optical Alignment System simplifies BGA rework, significantly reducing eye strain and boosting efficiency, making it easier for technicians to achieve perfect results. Enhance workplace comfort and productivity with our ergonomic design and advanced technology.
- Designed for precision, this system excels at reworking BGA, LED, IC, and other micro chipsets. It is particularly ideal for high-precision motherboard rework, offering reliable and repeatable outcomes, ensuring that your most delicate components are handled with care. Trust in our machine's consistency to deliver exceptional results.
- Perfect for BGA reballing and chipset repair, this machine is extensively used in laptops, PS3, PS4, XBOX360, mobile phones, and more, making it a versatile tool for various electronic repairs. Explore its wide-ranging applications and bring new life to your electronic devices.
- Efficiently handle rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond with ease and precision, ensuring that all your repair needs are met with the highest standards. Rely on our machine to support a broad spectrum of component types with unparalleled accuracy.
Key Features of the ZM-R7220A
- Equipped with a large infrared carbon fiber pre-heating system, it heats swiftly and uniformly while eliminating light pollution. This ensures optimal working conditions and maximizes efficiency. Enjoy quick and consistent heating for a smooth workflow.
- Temperature parameters are protected by authority limits, preventing any erroneous settings and ensuring safety and reliability, giving you peace of mind during operations. Operate with confidence knowing that accurate and safe temperature control is guaranteed.
- Supports ten segments of temperature control processes, ensuring compatibility with a wide range of BGA rework requirements, making it adaptable for various tasks. Tailor the machine to meet the specific demands of every project with precision.
- Store unlimited temperature profiles and access the necessary profiles instantly with a single key press, enhancing usability and saving time during setups. Streamline your workflow with efficient profile management and quick access.
- Three K-type sensors offer high-precision temperature testing and provide automatic curve analysis reports via PC, ensuring detailed monitoring and accurate adjustments. Benefit from exact measurements and comprehensive data analysis for optimal results.
- Automated de-soldering and soldering processes reduce the need for manual intervention, enhancing efficiency and consistency, ensuring that every job meets high standards. Focus on other tasks while the machine executes complex operations seamlessly.
- Adjustable hot air flow allows customization of the rework process for various chips, ensuring optimal outcomes tailored to your specific needs. Fine-tune the rework process to suit each component type perfectly.
- Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation, making the system easy to use and highly efficient. Enjoy effortless setup and control for a straightforward user experience.
- Convenient bottom hot air lifting control from the front panel enables on-the-fly adjustments, enhancing ease of use and allowing real-time changes during operations. Make quick adjustments effortlessly to maintain your workflow.
- Laser positioning accelerates and enhances the precision of component placement, making the process faster and more accurate, reducing errors and improving overall quality. Achieve pinpoint accuracy with our advanced positioning system.
In-Depth Features Overview
Independent Control Heaters
Top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. These heaters can heat the PCB simultaneously from both sides with temperature accuracy within ±3ºC. Multi-segment settings are available, and the adjustable IR preheating area ensures even heating across the PCB, preventing warping and ensuring high-quality repairs. Rely on our precise and balanced heating system for the best results.
Experience unparalleled efficiency with our innovative Micro Soldering Tool Kit for Professionals. Seamlessly heat both the PCB board and BGA chips concurrently, while a third IR heater preheats from below to prevent deformation. With top and bottom heaters operating independently, you achieve precise control, maximizing repair effectiveness.
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Select from our high-accuracy K-type close-loop thermocouple and enjoy the PID parameters automatic adjustment system, ensuring impeccable temperature control and consistent, reliable results every time.
Our advanced system displays seven temperature curves and allows you to save millions of data groups via a U storage device. Benefit from instant curve analysis for real-time BGA temperature assessments. High-precision sensors ensure reliable readings, providing the data needed for superior quality work.
Achieve unmatched precision with our state-of-the-art optical alignment system, guaranteeing perfect alignment and superior rework results for all your soldering needs.
Enhance your soldering precision with our advanced adjustable CCD color optical system. Featuring beam split, zoom, and meticulous micro-adjustment capabilities, it offers automatic chromatism resolution and adaptive brightness adjustment. Magnify up to 230X and achieve mounting accuracy within an astounding ±0.02mm.
Versatile Multi-Function Operation System
Elevate your precision with our high-definition human-machine interface, designed for flawless 'set up' and 'operate' modes, significantly minimizing errors. The innovative top heater and mounting head 2-in-1 design automatically detects BGA chips and mounting heights, ensuring superior performance. Customize and save up to 6 segments of rising and activity temperatures, store multiple temperature profiles, and enjoy seamless adaptation to all BGA nozzles with effortless 360° rotation. Customization options are available for your unique requirements.
Effortlessly achieve rapid, precise positioning with our V-groove PCB support, ideal for all PCB types. The flexible, removable universal fixture offers exceptional protection without damaging the PCB, accommodating various BGA repair sizes comfortably.
Unparalleled Safety Functions
Our sophisticated system, certified for safety with CE certification, triggers an alarm post-soldering and de-soldering and automatically powers off during temperature anomalies, providing double-layer protection. Secure your temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features
ensuring robust protection for
your PCB board components and the machine itself
in any abnormal situation.
Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer interface
Temperature Control: K-type thermocouple (Closed Loop), independent control with precision within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
|
|
|
| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
|
| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
|
| Tool box |
1 |
|
|
|
| PCB Fixture |
6 |
|
|
|
| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
|
| Vacuum sucker(max ) |
4 |
|
|
|
| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
|
| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
|
| K-type temperature line |
1 |
|
|
|
| Upper heating wire(1200W) |
1 |
|
|
|
| Heating plate(Black 1450W) |
1 |
|
|
|
| Total |
44 |
|
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