Introducing the ZM-R7220A-BGA Rework Station
Featuring a high-precision BGA mounting head with CCD optical align lens and intuitive touch screen control, our Optical Alignment System sets the gold standard in technology.
Experience unparalleled precision with laser positioning and joystick control.
Product Application Overview
- Capable of de-soldering and soldering all BGA components, our system can remove and repair various motherboard BGA IC chips and other components, accommodating both lead-free and leaded soldering.
- 2. Significantly reduce production costs by efficiently reworking faulty soldering IC chips during PCB assembly.
- Our state-of-the-art Optical Alignment System simplifies BGA rework, minimizing eye strain and enhancing efficiency.
- Engineered for precision, it excels in reworking BGA, LED, IC, and other micro chipsets. It is particularly suited for high-precision motherboard rework.
- Ideal for BGA reballing and chipset repair, it's widely used in laptops, PS3, PS4, XBOX360, mobile phones, and more.
- Efficiently rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond.
Main Features
- Boasting a large infrared carbon fiber pre-heating system, it heats quickly and evenly while eliminating light pollution.
- Temperature parameters are safeguarded by authority limits, preventing erroneous settings.
- Supports ten segments of temperature control processes, ensuring compatibility with all types of BGA rework.
- Unlimited temperature profile storage: access required profiles with just a single key press.
- Equipped with three K-type sensors for high-precision temperature testing, providing automatic curve analysis reports via PC.
- Automated de-soldering and soldering processes eliminate the need for manual adjustments.
- Adjustable hot air flow customizes the rework process for various chips.
- USB connectivity is driver-free and PC-controllable for seamless integration.
- Bottom hot air lifting control is conveniently accessible from the front panel, enabling on-the-fly adjustments.
- Laser positioning feature accelerates and enhances the precision of component placement.
Features Overview
Independent Control Heaters
The top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. The heaters can simultaneously heat the PCB from both sides, with temperature accuracy within ±3ºC. Multi-segment settings are available. The adjustable IR preheating area ensures even heating across the PCB.
Simultaneous heating of the PCB board and BGA chips, with the third IR heater preheating from below to prevent deformation during repairs. Top and bottom heaters operate independently.
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Choice of a high-accuracy K-type close-loop thermocouple and PID parameters automatic adjustment system.
Display seven temperature curves, save millions of data groups via U storage device, and utilize instant curve analysis for real-time BGA temperature assessment. Sensors ensure precise temperature readings.
Unmatched Precision with Our Optical Alignment System
Utilizes an adjustable CCD color optical system with beam split, zoom, and micro-adjustment functions. Features automatic chromatism resolution and brightness adjustment, magnifying up to 230X with a mounting accuracy within ±0.02mm.
Multi-Function Operation System
Experience unparalleled precision with our high-definition human-machine interface, meticulously designed for seamless 'set up' and 'operate' modes, effectively minimizing errors. Our groundbreaking top heater and mounting head 2-in-1 design automatically identifies BGA chips and mounting heights, ensuring exceptional soldering and de-soldering performance. Customize and save up to 6 segments of rising and activity temperatures, with the convenience to store multiple temperature profiles. It adapts effortlessly to all BGA nozzles, featuring 360° rotation for easy installation and replacement. Customization options are readily available to meet your specific needs.
Achieve rapid and precise positioning with ease, thanks to our V-groove PCB support, suitable for all PCB types. The flexible, removable universal fixture offers protective effects without damaging the PCB board, accommodating various BGA repair sizes comfortably.
Unparalleled Safety Functions
Certified for safety with CE certification, our system triggers an alarm post-soldering and de-soldering while automatically powering off when temperature anomalies occur, providing double-layer protection. Secure your temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features,
ensuring protection for
PCB board components and the machine itself
in any abnormal situation.
Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer connection
Temperature Control: K-type thermocouple (Closed Loop), independent control with accuracy within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
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| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
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| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
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| Tool box |
1 |
|
|
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| PCB Fixture |
6 |
|
|
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| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
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| Vacuum sucker(max ) |
4 |
|
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| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
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| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
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| K-type temperature line |
1 |
|
|
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| Upper heating wire(1200W) |
1 |
|
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| Heating plate(Black 1450W) |
1 |
|
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| Total |
44 |
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