Introducing the Revolutionary ZM-R7220A-BGA Rework Station: Elevate Your Rework Capabilities
Experience cutting-edge technology with our high-precision BGA mounting head, featuring a CCD optical align lens and an intuitive touch screen control system. The Optical Alignment System by Guangzhou Chuang Li You Machinery Co., Ltd. sets the gold standard in the industry, combining advanced engineering with user-friendly operation.
Achieve unmatched precision with state-of-the-art laser positioning and joystick control, ensuring flawless results every time. Our system promises seamless accuracy and effortless control for all your rework needs.
Comprehensive Product Application Overview: Redefining BGA Rework
- Our advanced system excels at de-soldering and soldering all BGA components. It expertly removes and repairs various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes with unparalleled precision.
- 2. Dramatically cut production costs by reworking faulty soldering IC chips during PCB assembly with unmatched efficiency, turning potential losses into savings.
- Our sophisticated Optical Alignment System simplifies BGA rework, significantly reducing eye strain and boosting efficiency, making intricate tasks more manageable.
- Designed for precision, this system excels at reworking BGA, LED, IC, and other micro chipsets. It is particularly ideal for high-precision motherboard rework, offering reliable and repeatable outcomes every time.
- Perfect for BGA reballing and chipset repair, this machine is extensively used in laptops, PS3, PS4, XBOX360, mobile phones, and more, demonstrating its versatile application capabilities.
- Efficiently handle rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond with ease and precision. Our system ensures meticulous results across a wide array of components.
Key Features of the ZM-R7220A: Unveiling Advanced Technological Excellence
- Equipped with a large infrared carbon fiber pre-heating system, it heats swiftly and uniformly while eliminating light pollution, ensuring optimal working conditions for superior performance.
- Temperature parameters are protected by authority limits, preventing any erroneous settings and ensuring safety and reliability during complex rework processes.
- Supports ten segments of temperature control processes, ensuring compatibility with a wide range of BGA rework requirements and providing versatile functionality.
- Store unlimited temperature profiles and access the necessary profiles instantly with a single key press, enhancing usability and streamlining operations for efficiency.
- Three K-type sensors offer high-precision temperature testing and provide automatic curve analysis reports via PC for detailed monitoring, ensuring meticulous quality control.
- Automated de-soldering and soldering processes reduce the need for manual intervention, enhancing efficiency and consistency in your rework operations.
- Adjustable hot air flow allows customization of the rework process for various chips, ensuring optimal outcomes tailored to specific component needs.
- Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation, making the system easy to implement into your existing workflow.
- Convenient bottom hot air lifting control from the front panel enables on-the-fly adjustments, enhancing ease of use and operational flexibility.
- Laser positioning accelerates and enhances the precision of component placement, making the process faster and more accurate, thus boosting productivity.
In-Depth Features Overview: Understanding the Complete Spectrum of Our BGA Rework System
Independent Control Heaters: Advanced Heating Solutions for Optimal Performance
Top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. These heaters can heat the PCB simultaneously from both sides with temperature accuracy within ±3ºC. Multi-segment settings are available, and the adjustable IR preheating area ensures even heating across the PCB, preventing warping and ensuring quality.
Simultaneous heating of the PCB board and BGA chips, with the third IR heater preheating from below to prevent deformation during repairs. Top and bottom heaters operate independently for precise control, ensuring optimal conditions for every task.
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Choose from high-accuracy K-type close-loop thermocouple and PID parameters automatic adjustment system, ensuring precise temperature control for all rework needs, enhancing reliability and outcomes.
Display seven temperature curves, save millions of data groups via U storage device, and utilize instant curve analysis for real-time BGA temperature assessment. Sensors ensure precise and reliable temperature readings, reflecting the system's advanced capabilities.
Unmatched Precision with Our Advanced Optical Alignment System: Ensuring Flawless Results Every Time
Unleash the power of precision with our adjustable CCD color optical system, featuring beam split, zoom, and micro-adjustment functions. This state-of-the-art system boasts automatic chromatism resolution and brightness adjustment, magnifying up to an impressive 230X. Achieve unmatched accuracy with a mounting precision within ±0.02mm.
Versatile Multi-Function Operation System
Experience unparalleled precision with our high-definition human-machine interface. This meticulously crafted system offers seamless 'set-up' and 'operate' modes, significantly reducing errors. With an innovative 2-in-1 top heater and mounting head design, it automatically detects BGA chips and mounting heights, delivering exceptional soldering and de-soldering performance. Customize and save up to 6 segments of rising and activity temperatures, and store multiple temperature profiles for ultimate convenience. Our machine adapts effortlessly to all BGA nozzles, featuring 360° rotation for easy installation and replacement. Customization options are readily available to meet your unique needs.
Achieve rapid and precise positioning with unparalleled ease, thanks to our V-groove PCB support. Perfectly suitable for all types of PCBs, the flexible, removable universal fixture offers protective effects without damaging the PCB board, comfortably accommodating various BGA repair sizes.
Unparalleled Safety Functions
Certified for safety with CE certification, our system triggers an alarm post-soldering and de-soldering. It automatically powers off when temperature anomalies occur, providing double-layer protection. Secure temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features
ensuring protection for
PCB board components and the machine itself
in any abnormal situation.
Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer connection
Temperature Control: K-type thermocouple (Closed Loop), independent control with accuracy within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
|
|
|
| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
|
| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
|
| Tool box |
1 |
|
|
|
| PCB Fixture |
6 |
|
|
|
| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
|
| Vacuum sucker(max ) |
4 |
|
|
|
| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
|
| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
|
| K-type temperature line |
1 |
|
|
|
| Upper heating wire(1200W) |
1 |
|
|
|
| Heating plate(Black 1450W) |
1 |
|
|
|
| Total |
44 |
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