• Professional BGA Rework Soldering System
  • Professional BGA Rework Soldering System
  • Professional BGA Rework Soldering System
  • Professional BGA Rework Soldering System
  • Professional BGA Rework Soldering System
  • Professional BGA Rework Soldering System

Professional BGA Rework Soldering System

After-sales Service: Online 24 Hours
Warranty: 1 Year
Type: Induction Heating Machine
Customization:
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Currency: US$
Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
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Professional BGA Rework Soldering System pictures & photos
Professional BGA Rework Soldering System
US $5,000-5,500 / Piece
Min. Order: 1 Piece
Gold Member Since 2018

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Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
ZM-R7220A
Certification
CE
Structure
Horizontal Type
Transport Package
Wooden Box
Specification
L81*W82*H115cm
Trademark
cly
Origin
China
HS Code
8515809090

Packaging & Delivery

Package Size
81.00cm * 82.00cm * 115.00cm
Package Gross Weight
125.000kg

Product Description

Introducing the Revolutionary ZM-R7220A-BGA Rework Station
Professional BGA Rework Soldering System
Experience cutting-edge technology with our high-precision BGA mounting head, featuring a CCD optical align lens and an intuitive touch screen control system. The Optical Alignment System by Guangzhou Chuang Li You Machinery Co., Ltd. sets the gold standard in the industry, offering unparalleled precision and ease of use.

Achieve unmatched precision with our state-of-the-art laser positioning and joystick control, ensuring flawless results every time you use the ZM-R7220A-BGA Rework Station.

Comprehensive Product Application Overview
  1. Our advanced system is adept at de-soldering and soldering all BGA components. It can expertly remove and repair various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes, making it a versatile choice for any repair needs.
  2. 2. Dramatically cut production costs by reworking faulty soldering IC chips during PCB assembly with unparalleled efficiency, reducing waste and enhancing productivity.
  3. Our sophisticated Optical Alignment System simplifies BGA rework, significantly reducing eye strain and boosting efficiency, making it easier for technicians to achieve perfect results.
  4. Designed for precision, this system excels at reworking BGA, LED, IC, and other micro chipsets. It is particularly ideal for high-precision motherboard rework, offering reliable and repeatable outcomes, ensuring that your most delicate components are handled with care.
  5. Perfect for BGA reballing and chipset repair, this machine is extensively used in laptops, PS3, PS4, XBOX360, mobile phones, and more, making it a versatile tool for various electronic repairs.
  6. Efficiently handle rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond with ease and precision, ensuring that all your repair needs are met with the highest standards.


Key Features of the ZM-R7220A
  • Equipped with a large infrared carbon fiber pre-heating system, it heats swiftly and uniformly while eliminating light pollution. This ensures optimal working conditions and maximizes efficiency.
  • Temperature parameters are protected by authority limits, preventing any erroneous settings and ensuring safety and reliability, giving you peace of mind during operations.
  • Supports ten segments of temperature control processes, ensuring compatibility with a wide range of BGA rework requirements, making it adaptable for various tasks.
  • Store unlimited temperature profiles and access the necessary profiles instantly with a single key press, enhancing usability and saving time during setups.
  • Three K-type sensors offer high-precision temperature testing and provide automatic curve analysis reports via PC, ensuring detailed monitoring and accurate adjustments.
  • Automated de-soldering and soldering processes reduce the need for manual intervention, enhancing efficiency and consistency, ensuring that every job meets high standards.
  • Adjustable hot air flow allows customization of the rework process for various chips, ensuring optimal outcomes tailored to your specific needs.
  • Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation, making the system easy to use and highly efficient.
  • Convenient bottom hot air lifting control from the front panel enables on-the-fly adjustments, enhancing ease of use and allowing real-time changes during operations.
  • Laser positioning accelerates and enhances the precision of component placement, making the process faster and more accurate, reducing errors and improving overall quality.
In-Depth Features Overview

Independent Control Heaters
Top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. These heaters can heat the PCB simultaneously from both sides with temperature accuracy within ±3ºC. Multi-segment settings are available, and the adjustable IR preheating area ensures even heating across the PCB, preventing warping and ensuring high-quality repairs.
Our Professional BGA Rework Soldering System offers simultaneous heating of the PCB board and BGA chips, preventing deformation during repairs with a third IR heater preheating from below. Enjoy independent control of the top and bottom heaters for unmatched precision and effectiveness.
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Select from high-accuracy K-type closed-loop thermocouple and an automated PID parameter adjustment system, ensuring precise temperature control for consistent, superior results.
Monitor seven temperature curves and save millions of data groups via a U storage device. Utilize instant curve analysis for real-time BGA temperature assessments. Sensors guarantee precise, reliable temperature readings, empowering you with the data for exceptional quality work.
Experience unmatched precision with our Advanced Optical Alignment System, ensuring perfect alignment and outstanding results for all your rework needs.
Enhance your soldering precision with our sophisticated adjustable CCD color optical system. Featuring beam split, zoom, and micro-adjustment capabilities, this state-of-the-art system offers automatic chromatism resolution and adaptive brightness adjustment, magnifying up to 230X and achieving mounting accuracy within ±0.02mm.

Versatile Multi-Function Operation System
Discover unprecedented precision with our high-definition human-machine interface, designed for impeccable 'set up' and 'operate' modes, significantly reducing errors. Our innovative top heater and mounting head 2-in-1 design automatically detects BGA chips and mounting heights, ensuring superior performance. Customize and save up to 6 segments of rising and activity temperatures, and store multiple temperature profiles. The machine adapts to all BGA nozzles with 360° rotation for easy installation and replacement, offering customization options to meet your unique needs.
Achieve rapid, precise positioning effortlessly with our V-groove PCB support, suitable for all PCB types. The flexible, removable universal fixture provides exceptional protection without damaging the PCB board, accommodating various BGA repair sizes comfortably.
Unparalleled Safety Functions
Certified for safety with CE certification, our advanced system triggers an alarm post-soldering and de-soldering, and automatically powers off during temperature anomalies, providing dual-layer protection. Secure your temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features
ensuring robust protection for
your PCB board components and the machine itself
in any abnormal situation.

Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer interface
Temperature Control: K-type thermocouple (Closed Loop), independent control with precision within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
ZM-R7220A BGA Rework Station Standard Accessories List
  Accessories Quantity      
Standard ZM-R7220A Seamark ZM BGA Rework Station 1      
Wooden case 1      
Manual 1      
Flux Brush 1      
Tool box 1      
PCB Fixture 6      
Handle Screw 6      
M5*28 Supporting Screw 6      
Vacuum sucker(max ) 4      
Vacuum sucker(Mid ) 4      
Vacuum sucker(Min) 4      
Top Nozzle 10*10mm 1      
Top Nozzle 20*20mm 1      
Top Nozzle 31*31mm 1      
Top Nozzle 41*41mm 1      
Bottom Nozzle 35*35 1      
Temperature sensor 1      
K-type temperature line 1      
Upper heating wire(1200W) 1      
Heating plate(Black 1450W) 1      
Total 44      

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From payment to delivery, we protect your trading.
Professional BGA Rework Soldering System pictures & photos
Professional BGA Rework Soldering System
US $5,000-5,500 / Piece
Min. Order: 1 Piece
Gold Member Since 2018

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory & Trading Company
Year of Establishment
2016-09-27
Plant Area
1000 square meters