ZM-R7220A-BGA Rework Station
BGA mounting head CCD optical align lens Touch screen control Optical alignment system
Laser position Joystick control
Product Application
- De-solder and solder all the BGA's, remove and repair different motherboard BGA IC chip and other components (Lead free & lead available).
- 2. It can cut down the production cost from reworking the bad soldering IC Chip during the PCB assembly procedure.
- The Optical alignment system, enables simple BGA rework preventing eye strain.
- It can rework the BGA, LED, IC and other micro chipsets in high precision. Especially suit for high precision motherboard rework, it is designed for precise rework.
- Widely used for BGA re-balling chipset repair in laptops, PS3, PS4, XBOX360, Mobile phone, etc.
- Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, etc.
Main features
- Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
- Temperature parameters protected by limits of authority, for avoiding error settings.
- Ten segments of temperature control process, suitable for all kinds of BGA Rework.
- Unlimited storage of the temperature profile, just need press one key to use the profile.
- Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
- De-soldering and soldering automatically, no need for manual adjustment.
- Hot air flow can be adjustable to meet the demand of any chips.
- USB Connection driver-free, controlled by PC.
- The bottom hot air lifting control available in the front panel, it can be conveniently adjusted at any time.
- Laser positioning available, to make the positioning faster.
Features introduced
Independent control heaters
Top and bottom heaters are hot-air, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time. Temperature accuracy within ±3ºC, there are multi segments can be set at the same time; IR preheating area is adjustable according to desire requests, to make PCB heating evenly.
It can heat PCB board and BGA chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently
.
The user can choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system
; it can show seven temperature curves and the millions of groups data can be saved through U storage device, with instant curves analysis function and analyzing BGA temperature at any time; the sensor is for precise temperature testing.
Precise optical alignment system
Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, amplify to 230 X, mounting accuracy within ±0.02mm.
Multi-function operation system
Experience precision like never before with our high-definition human-machine interface, designed for seamless 'set up' and 'operate' modes, minimizing error settings. The innovative top heater and mounting head 2-in-1 design automatically identifies BGA chips and mounting heights, delivering unmatched soldering and de-soldering capabilities. Customize and save up to 6 segments of rising and activity temperatures, with the flexibility to store multiple temperature profiles. Adaptable to all BGA nozzles, featuring 360° rotation for effortless installation and replacement. Customization options available to suit your specific needs.
Effortlessly achieve rapid, accurate positioning with our V-groove PCB support, suitable for all PCB types. The flexible, removable universal fixture provides protective effects without damaging the PCB board, accommodating various BGA repair sizes with ease.
Unparalleled Safety Functions
Certified for safety with CE certification, our system triggers an alarm post-soldering and de-soldering while automatically powering off when temperature anomalies occur, offering double-layer protection. Secure your temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features,
ensuring protection for
PCB board components and the machine itself
in any abnormal situation.
Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer connection
Temperature Control: K-type thermocouple (Closed Loop), independent control with accuracy within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
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|
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| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
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| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
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| Tool box |
1 |
|
|
|
| PCB Fixture |
6 |
|
|
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| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
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| Vacuum sucker(max ) |
4 |
|
|
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| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
|
| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
|
| K-type temperature line |
1 |
|
|
|
| Upper heating wire(1200W) |
1 |
|
|
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| Heating plate(Black 1450W) |
1 |
|
|
|
| Total |
44 |
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