Introducing the Revolutionary ZM-R7220A-BGA Rework Station!
Experience the pinnacle of modern technology with our high-precision BGA mounting head, featuring an advanced CCD optical align lens and an intuitive touch screen control system. The Optical Alignment System by Guangzhou Chuang Li You Machinery Co., Ltd. sets a new industry benchmark, offering unrivaled precision and effortless usability.
Achieve precision like never before with our state-of-the-art laser positioning and joystick control, ensuring flawless results every time you operate the ZM-R7220A-BGA Rework Station.
Comprehensive Product Application Overview
- Our advanced system excels in de-soldering and soldering all BGA components. It expertly handles the removal and repair of various motherboard BGA IC chips and other components, supporting both lead-free and leaded soldering processes. This versatility makes it an ideal choice for any repair needs.
- 2. Dramatically cut production costs by reworking faulty soldering IC chips during PCB assembly with unmatched efficiency, reducing waste and enhancing productivity.
- Our sophisticated Optical Alignment System simplifies BGA rework, significantly reducing eye strain and boosting efficiency, making it easier for technicians to achieve flawless results.
- Designed for precision, this system excels in reworking BGA, LED, IC, and other micro chipsets. It is particularly ideal for high-precision motherboard rework, offering reliable and repeatable outcomes to ensure your most delicate components are handled with utmost care.
- Perfect for BGA reballing and chipset repair, this machine is extensively utilized in laptops, PS3, PS4, XBOX360, mobile phones, and more, making it an indispensable tool for various electronic repairs.
- Efficiently handle rework for micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and beyond with precision and ease, ensuring all your repair needs are met with the highest standards.
Key Features of the ZM-R7220A
- Equipped with a large infrared carbon fiber pre-heating system, it heats rapidly and uniformly while eliminating light pollution. This ensures optimal working conditions and maximizes efficiency.
- Temperature parameters are safeguarded by authority limits, preventing erroneous settings and ensuring safety and reliability, giving you peace of mind during operations.
- Supports ten segments of temperature control processes, ensuring compatibility with a diverse range of BGA rework requirements, making it adaptable for various tasks.
- Store unlimited temperature profiles and access necessary profiles instantly with a single key press, enhancing usability and saving time during setups.
- Three K-type sensors offer high-precision temperature testing and provide automatic curve analysis reports via PC, ensuring detailed monitoring and accurate adjustments.
- Automated de-soldering and soldering processes reduce the need for manual intervention, enhancing efficiency and consistency. Every job meets the highest standards.
- Adjustable hot air flow allows customization of the rework process for various chips, ensuring optimal outcomes tailored to your specific needs.
- Driver-free USB connectivity and PC controllability ensure seamless integration and hassle-free operation, making the system easy to use and highly efficient.
- Convenient bottom hot air lifting control from the front panel enables on-the-fly adjustments, enhancing ease of use and allowing real-time changes during operations.
- Laser positioning speeds up and enhances the precision of component placement, making the process faster and more accurate, reducing errors and improving overall quality.
In-Depth Features Overview
Independent Control Heaters
Top and bottom heaters utilize hot air, while the third IR heater employs infrared heating. These heaters can simultaneously heat the PCB from both sides with temperature accuracy within ±3ºC. Multi-segment settings are available, and the adjustable IR preheating area ensures even heating across the PCB, preventing warping and ensuring high-quality repairs.
Simultaneous heating of the PCB board and BGA chips is achieved with our advanced system. The third IR heater preheats from below, preventing deformation during repairs. Top and bottom heaters operate independently, allowing for precise control and maximum effectiveness in every task.
.
Opt for our high-accuracy K-type close-loop thermocouple and PID parameters automatic adjustment system. This ensures precise temperature control and delivers consistent, unmatched results every time.
Display seven temperature curves and save millions of data groups via a U storage device. Enjoy instant curve analysis for real-time BGA temperature assessment. Our sensors guarantee precise and reliable temperature readings, providing essential data for high-quality work.
Benefit from Unmatched Precision with our Advanced Optical Alignment System, ensuring perfect alignment and superior results for all your rework needs.
Upgrade your soldering precision with our advanced adjustable CCD color optical system. This state-of-the-art system features beam split, zoom, and micro-adjustment capabilities. With automatic chromatism resolution and adaptive brightness adjustment, it magnifies up to 230X, achieving mounting accuracy within an astounding ±0.02mm.
Versatile Multi-Function Operation System
Experience precision like never before with our high-definition human-machine interface, meticulously designed for flawless 'set up' and 'operate' modes, significantly minimizing errors. Our innovative top heater and mounting head 2-in-1 design, which automatically detects BGA chips and mounting heights, ensures superior soldering and de-soldering performance. Customize and save up to 6 segments of rising and activity temperatures, with the flexibility to store multiple temperature profiles. The machine seamlessly adapts to all BGA nozzles with effortless 360° rotation, facilitating easy installation and replacement. Customization options are available to suit your unique requirements.
Achieve rapid, precise positioning effortlessly with our V-groove PCB support, ideal for all PCB types. The flexible, removable universal fixture offers exceptional protective effects without causing damage to the PCB board, comfortably accommodating various BGA repair sizes.
Unparalleled Safety Functions
Certified for safety with CE certification, our sophisticated system triggers an alarm post-soldering and de-soldering, and automatically powers off during temperature anomalies. This ensures double-layer protection. Secure your temperature parameters with a password to prevent unauthorized changes.
Prevent arbitrary changes
with our advanced safety features
ensuring robust protection for
your PCB board components and the machine itself
in any abnormal situation.
Specifications and Technical Parameters
Power: AC 220V±10%
Frequency: 50/60 Hz
Total Power: Max 5650W
Heater Power: Top heater 1450 W, Bottom heater 1200 W, IR heater 2700 W
Control System: Intelligent Programmable Controller, supports computer interface
Temperature Control: K-type thermocouple (Closed Loop), independent control with precision within ±3ºC
Positioning: V-groove, PCB support
PCB Size: Max 415×370 mm, Min 6×6 mm
BGA Chip Size: Max 60×60 mm, Min 2×2 mm
Dimensions: L685*W633*H850 mm
Sensor: 1 pc
Weight: 76 kg
Color: White
| ZM-R7220A BGA Rework Station Standard Accessories List |
| |
Accessories |
Quantity |
|
|
|
| Standard |
ZM-R7220A Seamark ZM BGA Rework Station |
1 |
|
|
|
| Wooden case |
1 |
|
|
|
| Manual |
1 |
|
|
|
| Flux Brush |
1 |
|
|
|
| Tool box |
1 |
|
|
|
| PCB Fixture |
6 |
|
|
|
| Handle Screw |
6 |
|
|
|
| M5*28 Supporting Screw |
6 |
|
|
|
| Vacuum sucker(max ) |
4 |
|
|
|
| Vacuum sucker(Mid ) |
4 |
|
|
|
| Vacuum sucker(Min) |
4 |
|
|
|
| Top Nozzle 10*10mm |
1 |
|
|
|
| Top Nozzle 20*20mm |
1 |
|
|
|
| Top Nozzle 31*31mm |
1 |
|
|
|
| Top Nozzle 41*41mm |
1 |
|
|
|
| Bottom Nozzle 35*35 |
1 |
|
|
|
| Temperature sensor |
1 |
|
|
|
| K-type temperature line |
1 |
|
|
|
| Upper heating wire(1200W) |
1 |
|
|
|
| Heating plate(Black 1450W) |
1 |
|
|
|
| Total |
44 |
|
|
|
){kind=link}
){kind=link}